Global 3D IC and TSV Interconnect Market, By Packaging Technology (3D Wafer-Level Chip-Scale Packagi

Published Date: | Report Code : IT1958583

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Growing market for smartphones, tablets and gaming devices is expected to drive the growth of 3D IC and TSV interconnect market during the forecast period. This has resulted some of the key developments by companies operating in the market to consolidate their market positions and look for further niche opportunities.

A 3D embedded circuit (3D IC) is a single embedded circuit constructed by stacking and/or interconnecting silicon wafers vertically to act as a single unit. 3D ICs can pack a lot of functionality into a tiny "footprint" by using TSV technology. The various stack devices may be heterogeneous, for example merging CMOS logic, DRAM and III-V components into a single IC. In addition, it is possible to drastically shorten critical electrical routes through the device, leading to quicker operation. TSV is included in the design of the Wide I / O 3D DRAM memory standard (JEDEC JESD229).

Among the multiple end products for 3D ICs and TSV interconnections, the most prospective product is memories. Sensors and, in specific, image sensors follow this. In a number of end products such as smartphones, tablet PCs, e-readers, laptops and more, the consumer electronics application sector is expected to hold the largest share in the market for 3D ICs and TSV interconnects.

Key Factors Impacting Market Growth:

  • Growing market for smartphones, tablets and gaming devices

  • Growing adoption of high-end computing, servers and data centers

  • Growing trend in electronic device miniaturization

  • High-unit 3D IC and 2.5D IC packages

Regional Analysis:

By region, the 3D IC and TSV interconnect market is estimated to be dominated by North America, Western Europe, and Asia Pacific during the forecast period. With technological advancements and cluster of global companies operating in these regions, these regions hold key to the growth and development of 3D IC and TSV interconnect market during the forecast period. Most of the leading companies have operations in these regions to cater the potential end users in the respective region. The North America 3D IC and TSV interconnect market is further segmented by US, Canada, and Mexico, whereas Germany, UK, France, Italy are estimated to be some of the major markets in Western Europe. Asia Pacific region is segmented by China, Japan, South Korea, India and Australia. Middle East and Eastern Europe are estimated to be potential markets with growing demand during the forecast period. Major countries in these regions include Russia, UAE, Saudi Arabia, Israel, and others.

Companies Covered: Taiwan Semiconductor Manufacturing Company Ltd., Samsung Electronics Co. Ltd., Toshiba Corp., Advanced Semiconductor Engineering Group, Amkor Technology.

Market Segmentation:

By Packaging Technology:

  • 3D Wafer-Level Chip-Scale Packaging (WLCSP)

  • 3D TSV

  • 2.5D

By Applications:

  • Logic

  • Imaging & Optoelectronics

  • Memory

  • MEMS/Sensors

  • LED

  • Power, Analog & Mixed Signal, RF, Photonics

By End-User Industry:

  • Consumer Electronics

  • Telecommunication

  • Industrial Sector

  • Automotive

  • Military & Aerospace

  • Smart Technologies

  • Medical Devices

By Region:

  • North America

    • By Country (US, Canada, Mexico)

    • By Packaging Industry

    • By Application

    • By End-User Industry

  • Western Europe:

    • By Country (Germany, UK, France, Spain, Rest of Western Europe)

    • By Packaging Industry

    • By Application

    • By End-User Industry

  • Eastern Europe:

    • By Country (Russia, Turkey, Rest of Eastern Europe)

    • By Packaging Industry

    • By Application

    • By End-User Industry

  • Asia Pacific

    • By Country (China, Japan, India, Rest of Asia Pacific)

    • By Packaging Industry

    • By Application

    • By End-User Industry

  • Middle East:

    • By Country (UAE, Qatar, Iran, Saudi Arabia, Rest of Middle East)

    • By Packaging Industry

    • By Application

    • By End-User Industry

  • Rest of the World

    • By Region (Latin America, Brazil, Rest of the World)

    • By Packaging Industry

    • By Application

    • By End-User Industry

Reasons To Buy This Report:

  • Market size estimation of the 3D IC and TSV interconnect market on a regional and global basis

  • The unique research design for market size estimation and forecast

  • Profiling of major companies operating in the market with key developments

  • Broad scope to cover all the possible segments helping every stakeholder in the market

Customization:

We provide customization of the study to meet specific requirements:

  • By Segment

  • By Sub-segment

  • By Region/Country

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