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The Advanced Packaging Market report points out national and global business prospects and competitive conditions for advanced packaging. Market size estimation and forecasts were given based on a detailed research methodology tailored to the conditions of the demand for advanced packaging. The advanced packaging market has been segmented by type (3d integrated circuit, fan out silicon in package, fan out wafer lever package, 3d wafer level package, wafer level chip scale package, 2.5d, flip chip), and industry vertical (consumer electronics, it & telecommunication industrial, automotive & transport, healthcare, aerospace &defense, others). Historical background for the demand of advanced packaging has been studied according to organic and inorganic innovations in order to provide accurate estimates of the market size. Primary factors influencing the growth of the demand advanced packaging have also been established with potential gravity. Major regions covered in the study include North America, Europe, Asia Pacific, Middle East & Africa, and South America.
Market Segmentation:
By Type:
By Industry Vertical:
By Region:
North America Advanced Packaging Market
Europe Advanced Packaging Market
Asia Pacific Advanced Packaging Market
Middle East & Africa Advanced Packaging Market
South America Advanced Packaging Market
Major Companies: ASE Group, Amkor Technology, Siliconware Precision Industries Co., Ltd. (SPIL), STATS ChipPAC Pte. Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., and Taiwan Semiconductor Manufacturing Company.
Years Covered in the Study:
Historic Year: 2017-2018
Base Year: 2019
Estimated Year: 2020
Forecast Year: 2028
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