Global High Density Interconnect Market, By Layers (4–6 Layers HDI, 8–10 Layers HDI, 10+ Layers

Published Date: | Report Code : IT1958547

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A High-Density Interconnect or an HDI is the fastest growing technology that is used in a printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards.

The market for high density interconnect is segmented based on the number of layers, applications, and end-users.

On the basis of the layers, the market is divided as 4-6, 8-10, and more than 10 layers. The more than 10 layers segment is anticipated to be the fastest-growing segment for the HDI market as this has a wide variety of applications. it is used in various devices such as high-density mobile devices, high-reliability automotive products, and many IoT modules. Its wide range of applications is due to its properties such as enhanced flexibility, lightweight construction and makes the product smaller in size.

Based on the applications, the market is segmented as Automotive Electronics, AV Devices, Connected Devices, Computer & Display, Communication Devices & Equipment, Wearable Devices, Others. The market will lead to applications in the wearable electronics segment. The various technical characteristics possessed by HDI PCBs such as high-density routing interconnections and to make high-density products, make the HDI boards of high performance and also lightweight. This attributes to the growth of this segment.

By the end-users, the market is bifurcated as Automotive, Consumer Electronics, Telecommunications, Medical, Others.

The APAC region is anticipated to grow greatly for this market. This is due to the increasing usage of consumer electronics, automotive and healthcare equipment which utilizes HDI. The ever increasing telecommunication networks in the emerging countries of India, China, South Korea are also driving the market.

Key Factors Impacting Market Growth:

  • Growing adoption of advanced electronics

  • Increasing demand for smart electronics and wearable devices

Regional Analysis:

By region, the high-density interconnect market is estimated to be dominated by North America, Western Europe, and the Asia Pacific during the forecast period. With technological advancements and a cluster of global companies operating in these regions, these regions hold key to the growth and development of high-density interconnect markets during the forecast period. Most of the leading companies have operations in these regions to cater to the potential end-users in the respective region.

The North America high-density interconnect market is further segmented by US, Canada, and Mexico, whereas Germany, UK, France, Italy are estimated to be some of the major markets in Western Europe. Asia Pacific region is segmented by China, Japan, South Korea, India, and Australia. The Middle East and Eastern Europe are estimated to be potential markets with growing demand during the forecast period. Major countries in these regions include Russia, UAE, Saudi Arabia, Israel, and others.

Companies Covered: Unimicron, Compeq Co., TTM Technologies, Austria Technologie & Systemtechnik, Zhen Ding Tech., MEIKO ELECTRONICS Co., FUJITSU INTERCONNECT TECHNOLOGIES, Daeduck GDS Co..

Market Segmentation:

By Layers:

  • 4–6 Layers HDI

  • 8–10 Layers HDI

  • 10+ Layers HDI

By Application:

  • Automotive Electronics

  • AV Devices

  • Connected Devices

  • Computer & Display

  • Communication Devices & Equipment

  • Wearable Devices

  • Others

By End Users:

  • Automotive

  • Consumer Electronics

  • Telecommunications

  • Medical

  • Others

By Region:

  • North America

    • By Country (US, Canada, Mexico)

    • By Layer

    • By Application

    • By End Users

  • Western Europe

    • By Country (Germany, UK, France, Italy, Spain, Rest of Western Europe)

    • By Layer

    • By Application

    • By End Users

  • Eastern Europe

    • By Country (Russia, Turkey, Rest of Eastern Europe)

    • By Layer

    • By Application

    • By End Users

  • Asia Pacific

    • By Country (China, Japan, India, South Korea, Australia, Rest of Asia Pacific)

    • By Layer

    • By Application

    • By End Users

  • Middle East

    • By Country (UAE, Saudi Arabia, Qatar, Iran, Rest of Middle East)

    • By Layer

    • By Application

    • By End Users

  • Rest of the World

    • By Region (South America, Africa)

    • By Layer

    • By Application

    • By End Users

Reasons To Buy This Report:

  • Market size estimation of the global High Density Interconnect Market on regional and global basis

  • Unique research design for market size estimation and forecast

  • Profiling of major companies operating in the market with key developments

  • Broad scope to cover all the possible segments helping every stakeholder in the market

Customization:

We provide customization of the study to meet specific requirements:

  • By Segment

  • By Sub-segment

  • By Region/Country

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