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The Wafer Fab Equipment Market report points out national and global business prospects and competitive conditions for Wafer fab equipment. Market size estimation and forecasts were given based on a detailed research methodology tailored to the conditions of the demand for Wafer fab equipment. The Wafer fab equipment market has been segmented by node size (7 nm and below, 10 nm, 14 nm, 22 nm, 32 nm, 45 nm, and 65 nm and above), by fabrication process (front-end-of-line processing, back-end-of-line processing), by end-user (foundry, memory, integrated device manufacturer). Historical background for the demand of Wafer fab equipment has been studied according to organic and inorganic innovations in order to provide accurate estimates of the market size. Primary factors influencing the growth of the demand Wafer fab equipment have also been established with potential gravity. Major regions covered in the study include North America, Europe, Asia Pacific, Middle East & Africa, and South America.
Market Segmentation:
By Node Size:
By Fabrication Process:
By End-User:
By Region:
North America Wafer Fab Equipment Market
Europe Wafer Fab Equipment Market
Asia Pacific Wafer Fab Equipment Market
Middle East & Africa Wafer Fab Equipment Market
South America Wafer Fab Equipment Market
Major Companies: Applied Materials, Inc., ASML, Dainippon Screen Manufacturing Co. Ltd., Hitachi Kokusai Electronic Inc., KLA-Tencor Corporation, Lam Research Corporation, Motorola Solutions, Inc., Nikon Corporation, Taiwan Semiconductor Manufacturing Company Limited, and Tokyo Electron Limited
Years Covered in the Study:
Historic Year: 2017-2018
Base Year: 2019
Estimated Year: 2020
Forecast Year: 2028
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